US Patent Issued to NANYA TECHNOLOGY on Jan. 27 for "Method of manufacturing integrated circuit device with bonding structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,781, issued on Jan. 27, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Method of manufacturing integrated circuit device with bonding structure" was invented by Tzu-Ching Tsai (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit device includes: a first substrate having a first barrier layer; a second substrate having a second barrier layer; a first conductive portion arranged over the first barrier layer; a second conductive portion arranged over the second barrier layer; a first expanding pad arranged on the first conductive portion and including a first contact area greater than that of the first conductive port...