US Patent Issued to NANYA TECHNOLOGY on Jan. 13 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,580, issued on Jan. 13, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Wu-Der Yang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate, a first semiconductor chip, a first bonding wire, a second substrate, a second semiconductor chip and a second bonding wire. The first substrate has a window through a center portion of the first substrate. The first semiconductor chip is located on the first substrate. The first bonding wire is in the window of the first substrate and electrically connects to the firs...