US Patent Issued to NANYA TECHNOLOGY on Feb. 3 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,586, issued on Feb. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Hsin-Mao Huang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a semiconductor chip, a plurality of conductive bumps and a molding compound. The package substrate has a first surface, a second surface opposite to the first surface, and at least one slot extending from the first surface to the second surface. The semiconductor chip is disposed on the package substrate and includes a chip circuit facing the slot of the packag...