US Patent Issued to NANYA TECHNOLOGY on Feb. 3 for "Circuit structure including at least one air gap and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,561, issued on Feb. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Circuit structure including at least one air gap and method for manufacturing the same" was invented by Hsih-Yang Chiu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit structure and a method of manufacturing a circuit structure are provided. The circuit structure includes a first metal line and a second metal line. The second metal line is disposed over the first metal line. At least one air gap is disposed between the first metal line and the second metal line."

The patent was filed on Oct. 17, 2023, under Application No. 18/380,901.

*For ...