US Patent Issued to NANYA TECHNOLOGY on Feb. 10 for "Wafer structure comprising multiple chips and dummy connectors including bonding and probing segments" (Taiwanese Inventor)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,801, issued on Feb. 10, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Wafer structure comprising multiple chips and dummy connectors including bonding and probing segments" was invented by Wu-Der Yang (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer structure includes a plurality of chips and a plurality of dummy connectors. The chips are separated from each other. Each of the chips includes a body and a plurality of conductive pads. The conductive pads are respectively and at least partially disposed on the body. The dummy connectors are connected with each other. Each of the dummy connectors is connected betw...