ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,493,071, issued on Dec. 9, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).
"Semiconductor wafer and testing module" was invented by Wei-Zhong Li (Taoyuan, Taiwan) and Hsih-Yang Chiu (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor wafer includes a scribe line and a probe pad. The scribe line extends along a first direction. The probe pad is disposed on the scribe line and is configured to contact a probe needle. The probe pad includes a first metal layer, a dielectric layer, and a second metal layer. The dielectric layer is disposed on the first metal layer, in which the dielectric layer includes a first recess...