US Patent Issued to NANYA TECHNOLOGY on Dec. 9 for "Semiconductor chips and method of manufacturing thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,495,602, issued on Dec. 9, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Semiconductor chips and method of manufacturing thereof" was invented by Hsih-Yang Chiu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a method of manufacturing semiconductor chips. The method includes performing a first dry etching process to remove a top metalization layer such that a portion of an interconnect structure is exposed by a scribe line opening after the top metalization layer is removed, wherein the interconnect structure is embedded in a dielectric layer. Next, a first wet etching process using a first ...