US Patent Issued to NANYA TECHNOLOGY on April 8 for "Interconnection structure having air gap and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,636, issued on April 8, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Interconnection structure having air gap and method for manufacturing the same" was invented by Tsu-Chieh Ai (Taitung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure and a method of manufacturing an interconnection structure are provided. The interconnection structure includes a first dielectric layer, a first conductive via in the first dielectric layer, and a first metal line disposed on the first dielectric layer and electrically connected with the first conductive via. At least a portion of the first metal line is exposed to ...