US Patent Issued to NANYA TECHNOLOGY on April 15 for "Manufacturing method of semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,211, issued on April 15, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan).

"Manufacturing method of semiconductor device" was invented by Yi-Jen Lo (New Taipei, Taiwan), Hsih Yang Chiu (Taoyuan, Taiwan), Ching Hung Chang (Taoyuan, Taiwan) and Chiang-Lin Shih (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a method of manufacturing a semiconductor device including bonding a second device wafer to a first device wafer, such that a first bonding interface including a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface is formed between the first device wafer and the seco...