US Patent Issued to NANTONG TONGFU MICROELECTRONICS, TONGFU MICROELECTRONICS on Oct. 7 for "Packaging structure and fabrication method thereof" (Chinese Inventor)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,098, issued on Oct. 7, was assigned to NANTONG TONGFU MICROELECTRONICS Co. LTD. (Nantong, China) and TONGFU MICROELECTRONICS Co. LTD. (Nantong, China).

"Packaging structure and fabrication method thereof" was invented by Yujuan Tao (Nantong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Packaging structure and fabrication method are provided. The method includes: providing semiconductor chips; providing soldering pads on the semiconductor chips, a metal bump on each soldering pad, and a first plastic encapsulation layer on functional surfaces of the semiconductor chips; providing a carrier plate; adhering the first plastic encapsulation layer ...