US Patent Issued to NANTONG ACCESS SEMICONDUCTOR on Aug. 26 for "Embedded packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,967, issued on Aug. 26, was assigned to NANTONG ACCESS SEMICONDUCTOR Co. LTD. (Jiangsu Province, China).

"Embedded packaging structure and manufacturing method thereof" was invented by Xianming Chen (Jiangsu Province, China), Lei Feng (Jiangsu Province, China), Benxia Huang (Jiangsu Province, China), Yue Bao (Jiangsu Province, China) and Wenshi Wang (Jiangsu Province, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer embedded packaging structure according to an embodiment includes a first dielectric layer and a second dielectric layer on the first dielectric layer. The first dielectric layer includes a first wiring layer. The second ...