US Patent Issued to Nano and Advanced Materials Institute on Sept. 16 for "Light or heat triggered frontally cured cure-on-demand adhesives kit" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,415,942, issued on Sept. 16, was assigned to Nano and Advanced Materials Institute Ltd. (Hong Kong, Hong Kong).

"Light or heat triggered frontally cured cure-on-demand adhesives kit" was invented by Yiu Sun Tam (Hong Kong, Hong Kong), Yong Zhu (Hong Kong, Hong Kong) and Chenmin Liu (Hong Kong, Hong Kong).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates is provided. The kit includes a first monomer/oligomer component and a UV or thermal cure catalyst component. In practical application, the first monomer/oligo...