US Patent Issued to Nanjing SemiDrive Technology on June 24 for "Multi-chip interconnection system and method thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,339,797, issued on June 24, was assigned to Nanjing SemiDrive Technology LTD. (Nanjing, China).

"Multi-chip interconnection system and method thereof" was invented by Xiongfei Liu (Nanjing, China), Qiaoyu Ye (Nanjing, China), Shaohui Gong (Nanjing, China) and Lihang Zhang (Nanjing, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-chip interconnection system includes a plurality of chips. A chip of the plurality of chips includes an extend serial peripheral interface (XSPI) master terminal, a data transmission terminal, an XSPI slave terminal, and a data reception terminal. The XSPI master terminal includes an advanced extensible interface (A...