US Patent Issued to NAN YA PRINTED CIRCUIT BOARD on Sept. 16 for "Circuit board structure and method for forming the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,992, issued on Sept. 16, was assigned to NAN YA PRINTED CIRCUIT BOARD Corp. (Taoyuan, Taiwan).

"Circuit board structure and method for forming the same" was invented by Cheng-An Wu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure is provided. The circuit board structure includes a first insulating layer, a second insulating layer, a vertical conductive feature, and an electronic element. The first insulating layer has multiple bumps thereon. The second insulating layer is disposed on the first insulating layer. The vertical conductive feature includes a first via hole and a second via hole extending vertical...