US Patent Issued to NAN YA PLASTICS on June 10 for "Method for smoothing surface of copper foil and copper foil obtained" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,929, issued on June 10, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan).

"Method for smoothing surface of copper foil and copper foil obtained" was invented by Te-Chao Liao (Taipei, Taiwan), Wei-Sheng Cheng (Taipei, Taiwan) and Chao-Tung Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for smoothing surfaces of a copper foil and the copper foil obtained are provided, wherein the method for smoothing surfaces of the copper foil includes the following steps. Supplied with a copper foil. A first electropolishing process is performed on the copper foil. The copper foil is subjected to a pickling process. A second electro...