US Patent Issued to NAN YA PLASTICS on July 22 for "Rubber resin material with high thermal conductivity and high dielectric constant and metal substrate using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,753, issued on July 22, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan).

"Rubber resin material with high thermal conductivity and high dielectric constant and metal substrate using the same" was invented by Te-Chao Liao (Taipei, Taiwan), Hung-Yi Chang (Taipei, Taiwan), Hao-Sheng Chen (Taipei, Taiwan) and Chia-Lin Liu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A rubber resin material with a high thermal conductivity and a high dielectric constant and a metal substrate using the same are provided. The rubber resin material includes a rubber resin composition, at least one first inorganic filler, and at least one second inor...