US Patent Issued to NAN YA PLASTICS on Dec. 9 for "Release carrier structure and copper foil composite structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,492,482, issued on Dec. 9, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan).

"Release carrier structure and copper foil composite structure" was invented by Te-Chao Liao (Taipei, Taiwan), Wei-Sheng Cheng (Taipei, Taiwan), Yu-Chi Hsieh (Taipei, Taiwan) and Chia-Shan Chang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A release carrier structure includes a carrier layer, a first release layer, and a second release layer. A weight ratio of organic matter in the second release layer is greater than a weight ratio of organic matter in the first release layer."

The patent was filed on Nov. 6, 2023, under Application No. 18/502,095.

*Fo...