US Patent Issued to NAN YA PLASTICS on April 29 for "Copper foil structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,632, issued on April 29, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan).

"Copper foil structure and manufacturing method thereof" was invented by Te-Chao Liao (Taipei, Taiwan), Wei-Sheng Cheng (Taipei, Taiwan) and Chao-Tung Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A copper foil structure and a manufacturing method thereof are provided. In some embodiments, the copper foil structure includes a copper foil layer and a conductive organic anti-oxidation layer. The conductive organic anti-oxidation layer is disposed on the copper foil layer, and the conductive organic anti-oxidation layer includes an organic antioxidant an...