US Patent Issued to NAGASE CHEMTEX on July 15 for "Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,310, issued on July 15, was assigned to NAGASE CHEMTEX Corp. (Osaka, Japan).

"Multi-layer sheet for mold underfill encapsulation, method for mold underfill encapsulation, electronic component mounting substrate, and production method for electronic component" was invented by Daisuke Mori (Hyogo, Japan), Masahiro Asahara (Hyogo, Japan), Katsushi Kan (Hyogo, Japan) and Eiichi Nomura (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "[Problem] To provide a multi-layer sheet for mold underfill encapsulation, which exhibits good infiltrability between electrodes. [Solution] In order to solve the aforementioned problem, the present invention pro...