US Patent Issued to Mycon on Nov. 25 for "Method for cooling and/or separating adhesively bonded components and/or removing adhesive residues from surfaces and jet apparatus herefor" (German Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,012, issued on Nov. 25, was assigned to Mycon GmbH (Bielefeld, Germany).

"Method for cooling and/or separating adhesively bonded components and/or removing adhesive residues from surfaces and jet apparatus herefor" was invented by Michael Wibbeke (Paderborn, Germany), Gerson Meschut (Bielefeld, Germany), Marc Wuensche (Detmold, Germany), Jan Ditter (Paderborn, Germany) and Jens-Werner Kipp (Bielefeld, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a cleaning method for removing adhesive residues from surfaces, in particular after separating an adhesive connection between adhesively joined partners, liquid carbon dioxide from a reservoir e...