US Patent Issued to MURATA MANUFACTURING on Sept. 9 for "Module having a changing filler content rate in sealing resin layer" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,794, issued on Sept. 9, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-fu, Japan).

"Module having a changing filler content rate in sealing resin layer" was invented by Toru Komatsu (Nagaokakyo, Japan) and Tadashi Nomura (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate, a first component, and a first sealing resin layer. The substrate includes a first principal surface. The first component is mounted on the first principal surface. The first sealing resin layer contains a filler containing an inorganic oxide as a main component. The first sealing resin layer is provided on the first principal sur...