US Patent Issued to MURATA MANUFACTURING on Sept. 9 for "Electronic component management method, and housing body for electronic components" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,061, issued on Sept. 9, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Electronic component management method, and housing body for electronic components" was invented by Kiyoyuki Nakagawa (Nagaokakyo, Japan), Yasuhiro Shimizu (Nagaokakyo, Japan), Nobuto Yamada (Nagaokakyo, Japan) and Naoto Ikeda (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component management method includes manufacturer-side steps including storing electronic components in a housing body that includes an RFID tag, writing in the RFID tag at least one piece of manufacturer-side information related to the electronic components sto...