ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,290, issued on Sept. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Semiconductor device and module" was invented by Korekiyo Ito (Nagaokakyo, Japan), Masatomi Harada (Nagaokakyo, Japan) and Yuta Imamura (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device that includes: a substrate having a first main surface and a second main surface opposite to each other in a thickness direction; a circuit layer on the first main surface of the substrate, the circuit layer having a first electrode layer, a second electrode layer, a dielectric layer between the first electrode layer and the second elec...