US Patent Issued to MURATA MANUFACTURING on Sept. 30 for "Radio-frequency module and communication apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,934, issued on Sept. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio-frequency module and communication apparatus" was invented by Takanori Uejima (Kyoto, Japan) and Hiromichi Kitajima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; and a metal shield plate disposed over the major face and set to a ground potential. The metal shield plate includes a shield part extending in a direction perpendicular to the major face, and a joint part parallel...