US Patent Issued to MURATA MANUFACTURING on Sept. 30 for "Multilayer substrate and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,603, issued on Sept. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate and manufacturing method therefor" was invented by Yushi Soeta (Nagaokakyo, Japan), Kentarou Kawabe (Nagaokakyo, Japan), Kouki Shimizu (Nagaokakyo, Japan), Toru Kurisu (Nagaokakyo, Japan) and Akihiro Yamakawa (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer body has a structure including insulating layers stacked on each other in an up-down direction. A first conductive layer is on a top main surface of one of the insulating layers. A first signal is transmitted through the first conductive layer. A second condu...