ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,858, issued on Sept. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module and method for manufacturing same" was invented by Minoru Hatase (Nagaokakyo, Japan) and Yoshihito Otsubo (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate having a first surface and at least one recess on the first surface, and an electronic component mounted on the first surface. The electronic component is connected to the substrate via a plurality of bumps. All of the plurality of bumps are connected to the first surface inside any of the at least one recess. A height of the plurality of bumps is greate...