US Patent Issued to MURATA MANUFACTURING on Sept. 30 for "Acoustic wave device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,859, issued on Sept. 30, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Acoustic wave device" was invented by Toshiki Tabei (Nagaokakyo, Japan) and Junpei Yasuda (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device includes a first acoustic wave chip and a second acoustic wave chip mounted on a substrate, first bumps bonding the first acoustic wave chip to the substrate and including first ground bumps connected to a ground potential, second bumps bonding the second acoustic wave chip to the substrate and including second ground bumps connected to a ground potential. When a number of the first gr...