US Patent Issued to MURATA MANUFACTURING on Sept. 23 for "Multilayer substrate and electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,720, issued on Sept. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate and electronic device" was invented by Hironobu Takahashi (Nagaokakyo, Japan), Fumiya Isono (Nagaokakyo, Japan) and Kenji Matsuda (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a first region, a multilayer body is bent along a first bending line such that a first main surface is located farther on an outer peripheral side than a second main surface. In a second region, the multilayer body is bent along a second bending line such that the first main surface is located farther on an inner peripheral side than the second m...