ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,528, issued on Sept. 23, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Takahiro Kitazume (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module comprises: a substrate having a first surface; a first component that is mounted on the first surface; a first sealing resin that covers the first surface and at least a portion of the first component that is connected to the first surface; a first conductor pattern that is disposed on a surface of the first sealing resin that is farther from the first surface; and a wire that serves as a plurality of co...