ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,980, issued on Sept. 16, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Wiring board" was invented by Tomoki Yamamoto (Nagaokakyo, Japan) and Tatsunori Kan (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a sec...