US Patent Issued to MURATA MANUFACTURING on Sept. 16 for "Circuit board and method of manufacturing circuit board" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,977, issued on Sept. 16, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Circuit board and method of manufacturing circuit board" was invented by Kosuke Nishio (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board includes one or more insulator layers, and upper and lower principal surfaces, and conductor layers in or on the substrate body. The conductor layers include a pair of first and second conductor layers on one of the insulator layers. Each of the pairs of the first and second conductor layers includes a first proximity section in which the first and second conductor layers are aligned in an orthog...