US Patent Issued to MURATA MANUFACTURING on Oct. 7 for "Multilayer substrate" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,505, issued on Oct. 7, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate" was invented by Keisuke Teranishi (Nagaokakyo, Japan) and Hirotaka Fujii (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a multilayer substrate, first interlayer connection conductors pass through resin layers in a lamination direction and electrically connect first and second signal conductors. Second interlayer connection conductors pass through the resin layers in the lamination direction and electrically connect the first and second signal conductors. The first interlayer connection conductors are aligned in a first row...