US Patent Issued to Murata Manufacturing on Oct. 28 for "Transversely-excited film bulk acoustic resonators wafer-level packaging using a dielectric cover" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,962, issued on Oct. 28, was assigned to Murata Manufacturing Co. Ltd. (Nagaokakyo, Japan).

"Transversely-excited film bulk acoustic resonators wafer-level packaging using a dielectric cover" was invented by Dylan Kelly (San Diego), Andrew Guyette (San Mateo, Calif.) and Patrick Turner (San Bruno, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic resonator device includes a substrate having a surface and a single-crystal piezoelectric plate bonded to the substrate surface. A portion of the piezoelectric plate forms a diaphragm that spans a cavity. A conductor pattern including an interdigital transducer (IDT) formed on a surface of th...