ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,642, issued on Oct. 28, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-fu, Japan).
"Module" was invented by Tadashi Nomura (Nagaokakyo, Japan) and Tetsuo Sato (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes: a substrate having a first surface and a second surface opposed to each other; a component mounted on the first surface; a sealing resin that covers the first surface and the component; a shield film formed to cover an upper surface and a side surface of the sealing resin and a side surface of the substrate; and a resist film formed to cover the second surface. The resist film has a plurality of protrusi...