US Patent Issued to MURATA MANUFACTURING on Oct. 21 for "Multilayer board, electronic device, and multilayer board inspection method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,284, issued on Oct. 21, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer board, electronic device, and multilayer board inspection method" was invented by Kiminori Kouno (Nagaokakyo, Japan) and Koji Kamada (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer board includes a first insulator layer including a first coil pattern thereon, a second insulator layer including a second coil pattern thereon, a third insulator layer including a third coil pattern thereon, a first terminal on the first insulator layer and connected to one end of the first coil pattern, a first floating pattern on the first in...