US Patent Issued to MURATA MANUFACTURING on Oct. 14 for "Radio frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,159, issued on Oct. 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Radio frequency module and communication device" was invented by Takanori Uejima (Kyoto, Japan) and Hiromichi Kitajima (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency module includes a module substrate, a first component disposed on a principal surface side of the module substrate, a metal shield wall disposed on an upper surface of the first component and set to ground potential, a resin member covering the principal surface of the module substrate, the upper surface and a side surface of the first component, and a side surface of t...