ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,534, issued on Oct. 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Mounting structure and mounting method of electronic component" was invented by Daichi Satou (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A mounting structure of an electronic component includes at least two electrode pads spaced apart from each other on a board, at least two external electrodes of the electronic component respectively connected to the at least two electrode pads, and a resist film located around each of the at least two electrode pads on a surface of the board. A predetermined separation distance in a surface direction of the...