ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,157, issued on Oct. 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-Fu, Japan).
"Module" was invented by Yoshihito Otsubo (Nagaokakyo, Japan) and Minoru Komiyama (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a substrate having a first surface, components as one or more components mounted on the first surface, a resin film covering the one or more components along a shape of the one or more components and covering part of the first surface, a first shield film formed to overlap the resin film, and a first sealing resin as a sealing resin disposed to cover the first surface, the one or more components, an...