US Patent Issued to MURATA MANUFACTURING on Oct. 14 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,111, issued on Oct. 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High frequency module and communication device" was invented by Keisuke Nishio (Kyoto, Japan), Masanori Kato (Kyoto, Japan) and Syunsuke Kido (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "To suppress degradation of characteristics, a high frequency module includes a mounting substrate, a first signal terminal, a second signal terminal, and ground terminals, and a hybrid filter. The hybrid filter is coupled between the first signal terminal and the second signal terminal. The hybrid filter includes an acoustic wave filter having at least one acoustic...