US Patent Issued to MURATA MANUFACTURING on Oct. 14 for "High-frequency module and communication apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,533, issued on Oct. 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"High-frequency module and communication apparatus" was invented by Terumichi Kita (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Coupling between inductors is restrained, and the layout area of a substrate is also ensured. A high-frequency module includes a mounting substrate, a first inductor, a second inductor, at least one high-frequency component, a shield layer, and a conductive member. The mounting substrate has a main surface. The first inductor is located on a main surface side of the mounting substrate. The second inductor is located on the ...