US Patent Issued to MURATA MANUFACTURING on Oct. 14 for "Elastic wave device and method for manufacturing the same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,445,105, issued on Oct. 14, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Elastic wave device and method for manufacturing the same" was invented by Munehisa Watanabe (Nagaokakyo, Japan), Hideki Iwamoto (Nagaokakyo, Japan), Hajime Kando (Nagaokakyo, Japan) and Syunsuke Kido (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An elastic wave device includes a supporting substrate, a high-acoustic-velocity film stacked on the supporting substrate and in which an acoustic velocity of a bulk wave propagating therein is higher than an acoustic velocity of an elastic wave propagating in a piezoelectric film, a low-acoustic-veloc...