ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,740, issued on Nov. 4, was assigned to Murata Manufacturing Co. Ltd. (Nagaokakyo, Japan).
"Semiconductor device and module" was invented by Hiroshi Matsubara (Nagaokakyo, Japan), Masatomi Harada (Nagaokakyo, Japan) and Takeshi Kagawa (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrode layers on a side of the semiconductor substrate, a diele...