ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,159, issued on Nov. 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto-fu, Japan).
"Module" was invented by Shota Hayashi (Nagaokakyo, Japan), Nobuaki Ogawa (Nagaokakyo, Japan), Yuki Asano (Nagaokakyo, Japan), Takanori Uejima (Nagaokakyo, Japan), Hiromichi Kitajima (Nagaokakyo, Japan) and Takahiro Eguchi (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a ...