ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,602, issued on Nov. 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"High-frequency module and communication device" was invented by Teruaki Oshita (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To achieve miniaturization. A matching circuit is connected to a connection terminal that is one of an input terminal and an output terminal of an amplifier. A mounting substrate has a ground layer. The matching circuit includes a main line, a sub-line, and an IC chip. The main line is formed of a first conductor pattern intersecting a thickness direction of the mounting substrate, and is connected to a connection terminal of th...