ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,712, issued on Nov. 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Electronic circuit device" was invented by Keiichi Honda (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor substrate includes a fuse memory that is a write-once memory, a control unit that writes and reads data to and from the fuse memory, and a digital. A wiring layer includes a wiring conductor that connects the digital and an external connection terminal and a plane conductor provided in between the wiring conductor and a surface of the semiconductor substrate. The wiring conductor overlaps the fuse memory when the wiring conductor and ...