US Patent Issued to MURATA MANUFACTURING on Nov. 4 for "Circuit board and electronic-component-equipped circuit board" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,653, issued on Nov. 4, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Circuit board and electronic-component-equipped circuit board" was invented by Kenji Matsuda (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer body includes insulator layers including a first insulator layer laminated in a vertical direction. Electrodes include a signal electrode and are provided at an upper main surface of the first insulator layer and arranged in a transverse direction. At least a portion of each of the electrodes is exposed to outside from a circuit board. First and second interlayer connection conductors extend throu...