ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,732, issued on Nov. 25, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan).
"Module" was invented by Shinji Otani (Nagaokakyo, Japan), Akitomo Takahashi (Nagaokakyo, Japan), Takaaki Sakai (Nagaokakyo, Japan), Takeshi Furukawa (Nagaokakyo, Japan) and Tatsuya Kitamura (Nagaokakyo, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A module is used in a semiconductor composite device that supplies a direct-current voltage adjusted by a voltage regulator including a semiconductor active element to a load. The module includes a capacitor layer including at least one capacitor portion forming a capacitor, a connection terminal used for el...