US Patent Issued to MURATA MANUFACTURING on Nov. 25 for "Method for manufacturing ceramic electronic chip component" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,601, issued on Nov. 25, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Method for manufacturing ceramic electronic chip component" was invented by Kota Zenzai (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a ceramic electronic chip including an outer electrode including a glass-free sintered layer containing no glass. The method includes providing a glass-free conductive paste including a conductive metal powder and a thermosetting resin, the conductive metal powder including an alloy of tin and at least one of copper and nickel, and the glass-free conductive paste containing no glass, an...