US Patent Issued to MURATA MANUFACTURING on Nov. 18 for "Multilayer substrate and method for manufacturing multilayer substrate" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,648, issued on Nov. 18, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).

"Multilayer substrate and method for manufacturing multilayer substrate" was invented by Kosuke Nishio (Nagaokakyo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer substrate includes laminated insulating layers each including a main surface on which a conductor is provided. The multilayer substrate also includes a signal line defined by the conductors, and a shield conductor defined by the conductors. The shield conductor includes an opening and a portion overlapping the signal line in plan view. At least one of the insulating layers includes a vo...