ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,206, issued on Nov. 11, was assigned to MURATA MANUFACTURING Co. LTD. (Kyoto, Japan).
"Radio frequency module and communication device" was invented by Kunitoshi Hanaoka (Kyoto, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The firs...